german_user wrote: ↑Tue Dec 31, 2024 2:20 pm
If i read the specs right there is no big difference in the size of BRam. The clockrates that would be possible is the big question.
OK, let me walk you through this. First, I should clarify - when I said "BRAM", I was talking about all forms of embedded memory inside the FPGA.
This is not about board specifications; it's about FPGA chip specifications - for that, we need to look at the specific chips being used:
DE10-Nano: chip 5CSEBA6U23I7
On the product page ( https://www.intel.com/content/www/us/en ... ducts.html ), look at row "Cyclone V 5CSEA6 FPGA".
DE25-Standard: chip A5ED013BB32AE4S (when available)
On the product page ( https://www.intel.com/content/www/us/en ... eries.html ), look at the rows corresponding to "A5E 013B".
You will see that there are various measures which aren't exactly apples-for-apples comparisons, because these are well over 10 years apart in age.
But, for example:
Logic Elements (LE):
DE10 = 110000
DE25 = 138,060 (25% more than DE10) -> but there are ALSO 46,800 "Adaptive Logic Modules" (whatever that may imply - perhaps they are even more flexible than LEs)
-> Since an entire 486-class PC plus VGA scaler can fit in 110K LEs, an additional 25% is actually quite a big jump.
Adaptive Logic Modules would most likely improve this considerably, but I'm not yet familiar with them.
DSPs:
DE10 = 112
DE25 = 376 (more than triple DE10)
-> DSPs are currently used primarily for sound and video filters; additional uses would be possible with additional resources.
Maximum Embedded Memory:
DE10: 6.191Mb (that's megabits, not megabytes) -> Includes both M10K and MLAB blocks
DE25: M20K = 6.99Mb + MLAB 1.43Mb = 8.42Mb (36% more than DE10)
I would say that embedded memory is a much more precious commodity than LEs, as they are so flexible and can be configured as so many different types of memories at high speeds, the fact that they are parallel-access to a massive degree, and that they are easy to use. Developers would prefer to use embedded memory over any other type for all these reasons, but have to go to external SDRAM or DDR3 for various things because embedded memory is a limited resource. When moving to external SDRAM or DDR3, a developer needs to take into account latency, bandwidth, access algorithms, and the fact that they are generally single-access into consideration - meaning that a lot of developer time is spent on figuring out which memories to use for which purposes and how to allocate limited bandwidth in order to prevent conflicting accesses and optimize their use.
A 36% increase in the amount of embedded memory available could "make or break" a lot of cores which are on the edge, and could simplify cores which otherwise would need to implement these complex access strategies.